IPC APEX EXPO 2014 Technical Conference Spotlights Changing Technologies

BANNOCKBURN, Ill., USA, February 3, 2014 — Changing technologies that are driving the electronics industry will be center stage throughout the IPC APEX EXPO® technical conference, which takes place Tuesday, March 25 to Thursday, March 27, 2014, at the Mandalay Bay Convention Center in Las Vegas.

In keeping with the event's theme, "New Ideas … For New Horizons," industry experts will present 100 technical papers detailing original research and innovations in the areas of board fabrication and design, electronics assembly and test.

"Industry professionals need to keep up with changing technologies to stay on track for success," says Jasbir Bath, IPC APEX EXPO technical conference director. "The papers selected by the technical program committee deliver on bringing attendees solutions to today's challenges as well as preparing them for emerging technologies that will shape the industry's future."

Conference attendees will have the opportunity to learn about advancements in the areas of nanomaterials; solder paste and epoxy reliability; assembly and reliability of bumped components; printed electronics; miniaturization and high density; printing; embedded technology; corrosion and tin whiskers; BTC reliability; automation and many more.

The complete list of technical conference sessions is available at www.IPCAPEXEXPO.org/conference. Attendees who register by February 28 for one day, the full conference or the All Access Package will receive 20 percent off registration fees. Registration packages offering additional savings can be viewed at www.IPCAPEXEXPO.org/registration-options.